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Thick-film hybrid IC

No troublesome post-adjustments needed! You can print resistors on a ceramic substrate!

The "thick-film hybrid IC" uses a ceramic substrate, which can suppress the temperature rise of electronic components. The pattern is fired onto the ceramic substrate at approximately 800°C. The heat resistance of the ceramic substrate is higher than that of PWB due to high-temperature processing, ensuring reliability. In addition, we also handle "hybrid ICs" that can reduce total manufacturing costs through modularization. 【Features】 ■ Excellent heat dissipation ■ Miniaturization through printed resistance ■ Function trimming ■ High reliability ■ Available in SIP type and DIP type *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board

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